Momentum II HiE

AccuCheck Print Capability Verification allows the printer to measure its own print capability. Users can verify the machine’s capability at any time or continuously on their own products. AccuCheck measures the actual print deposit position versus the target pad to determine a measured print offset. It is an inexpensive, reliable method of obtaining machine quality and process capability information to ensure repeatable results and optimum printing performance.

Provides the flexibility to handle all stencil sizes with a simple adjustment of the shelf. The robust design provides better stability on all stencil sizes.

Dispense for standard cartridges or choose the new patent-pending jar dispenser. Paste is released in precise, measured amounts across the stencil in a clean, uniform bead. Deposition volumes, frequency and placement are user programmable.

BridgeVision is a patented method of analyzing bridge defects on circuit boards in the post-print inspection process. This innovative system utilizes texture-based image acquisition algorithms and a digital camera system with telecentric lenses to support the accurate identification of paste deposit defects.

StencilVision utilizes texturebased technology to check the underside of a stencil for solder paste contamination. Wiper operation can be driven by the results obtained.

The EdgeLoc system uses a side snugging technique that removes the need for top clamps which interfere with the PCB to stencil contact. The result is optimal gasketing and more volumetrically  consistent edge-to-edge prints. With EdgeLoc II, robust flippers engage to secure the board across the top edge ensuring board flatness then move out of the way once the board is firmly gripped from the side. EdgeLoc+ board clamping can change between edge and top clamping simply through software.

The MPM EnclosedFlow Print Head delivers uniform aperture filling and superb printing performance especially for fine pitch devices, with tremendous savings on solder paste over squeegee blade printing – in excess of 50% over blades for dramatically fast ROI. Printing fine features such as 01005s and 0.3mm pitch CSPs with up to 50% greater volume and 25% lower deviation than metal blades.

MPM’s patented printer based Vision and Inspection system is a cost-effectiveway to verify print and paste deposit results. It is flexible enough to handle the complete range of today’s most challenging components. This system measures the amount of paste covering the target pad and compares it with the required coverage. 2D inspection is integrated directly into the stencil printer to provide an immediate source of data.

The Paste Height Monitor is designed to prevent defects caused by inadequate volumes of paste on the stencil. It combines advanced software and sensor technology to accurately monitor the paste bead for volume  consistency. Upper and lower limit roll-height monitoring eliminates insufficient or excess paste volumes. It is a non-contact solution that can automatically add more paste to the stencil as it is needed.

Temperature monitoring ensures proper paste viscosity to avoid bridging and voiding. MPM patent-pending paste temperature monitor allows paste to be measured in the cartridge or on the stencil.

New quick release squeegee blades makes changing blades quick and easy with no tools required. It takes less than 30 seconds to change the blade.

RapidClean is a high-speed stencil solvent cleaning innovation that slashes cycle time and improves stencil cleaning performance. RapidClean can save up to $10K USD per nnum in paper savings per printer.

SPI Print Optimizer brings your Solder Paste Inspection (SPI) machine into communication with your MPM printer through a specially-developed common interface. When the SPI machine ‘sees’ X, Y and theta offset problems on a just-printed PCB, it analyzes the data virtually instantly and gives the printer instructions to correct those offsets, automatically, and ‘on the fly’.