TRI – 3D Solder Paste Inspection (SPI) – TR7007 SII Plus
INTRODUCTION
With industry leading speeds of up to 200 cm2/sec, the TR7007 SII Plus is the perfect SPI solution for any production line. This highly accurate inline shadow-free solder paste inspection solution offers full 3D inspection at resolutions of 15 µm or 10 µm. Built on a high precision, reliable linear motor platform, the system’s hallmark features include closed loop function, enhanced 2D imaging, auto-warp compensation and fringe pattern technology. TRI’s quick and intuitive user interface makes programming simple and easy, bringing maximum value to your production.
- Features
• Industry leading inspection speed up to 200 cm2/sec @ 15 µm
• Shadow free Fringe Pattern lighting technology
• Optical resolution 10 µm or 15 µm
• Linear motor design for stable and accurate inspection
• Advanced SPC functions for production quality monitoring and evaluation
Specification
