TRI – 3D Solder Paste Inspection (SPI) – TR7007 SII
INTRODUCTION
Offering inspection speeds of up to 200 cm2/sec, the TR7007 SII is the fastest solder paste inspection system in the industry. This highly accurate inline shadow-free solder paste inspection solution offers full 3D inspection at resolutions of 15 µm or 10 µm. Built on a high precision linear motor platform, the system’s hallmark features include closed loop function, enhanced 2D imaging, auto-warp compensation and fringe pattern technology. Increase capacity without sacrificing additional space with an available dual-lane configuration.
- Features
• World’s fastest inspection speed up to 200 cm2/sec @ 15 µm
• Shadow free Fringe Pattern lighting technology
• Optical resolution 10 µm or 15 µm
• Linear motor X-Y table for vibration free accurate inspection
Specification
