ITW EAE – VectraElite Wave Soldering Machine
THE ELECTROVERT® VECTRAELITE™
The Electrovert® VectraElite™ wave soldering machine is ideal for medium-to-high mass board assemblies where fast changeover, process flexibility, and system reliability are required. The VectraElite combines innovative technology in an accessible, ergonomic platform with a zero-defect process at the lowest possible cost of ownership. Process width is 457mm (18 in) with optional 508mm (20 in ), short and full N2 tunnel features.
Check out Electroverts New Option!
Electrovert’s new DwellFlex 4.0 variable contact wave solder nozzle. The DwellFlex 4.0 is the first nozzle designed specifically with Industry 4.0 automation in mind. THe patent-pending design enables the wave width to be adjusted on-the-fly as variable board types are run through the weave. This ensures solder contact time is optimized for a high-mix of board types without changing conveyor speeds. For more infomraiton see options below under the Enhanced features.
As the complexity of board assemblies continues to increase, board manufactures are looking for the best solution in a wave soldering system. The solution must meet their soldering expectations for today as well as for the future. The Electra is the machine of choice by major OEMs, EMS providers, and high reliability manufacturers.
PROVEN PERFORMANCE, WORLD CLASS RESULTS
Achieving the best solder joint quality, maximum topside hole fill, and zero defects are challenges with high mass, difficult-to-solder PCBs. The Electra’s features, including ServoJet™ fluxing, forced convection preheat, and DwellMax Plus™ solder nozzles, provide board assemblers the capability to process the most difficult soldering applications in the most demanding environments.
Lead-Free Process Capability
The Electra has been soldering lead-free applications for many years. The cast iron solder pot and its components are resistant to the corrosive nature of lead-free solders, and are capable of withstanding temperatures of 302° C (576° F). All stainless steel components that come into contact with the solder are composed of a special corrosion-resistant surface conversion as standard, or titanium as an option. Features such as our Quick Change solder pot provide the flexibility to easily change alloys in a safe and timely manner.
Large Board Capability
High-end and high reliability board assemblers recognize the importance of having the ability to process large, thick assemblies and pallets through their wave solder system. The Electra is one of the only wave solder systems in the industry to have 610 mm (24” inch) process width capability. The robust conveyor is designed to handle the weight of thick boards and pallets while automatic lead clearance and motorized width adjustment are standard.
Solder Nozzle Technologies
Electrovert’s UltraFill™, DwellMax™ Plus and DwellMax Ultra solder nozzles are designed to provide maximum top-side hole fill, provide the best hole fill quality, improve first pass yields, reduce dross , and promote easy maintenance. DwellMax Plus’ extra-wide chip nozzle and modified UltraFill nozzle are ideal for soldering thick, high thermal mass circuit boards.
Preheat Capability
The Electra is capable of up to 2.4 meters (8 feet) of bottom side preheat and up to 1.8 meters (6 feet) of topside preheat. Multiple forms of preheat are offered for complete process flexibility; these include IsoThermal™ forced convection, fast response IR, and Infrared radiant. All preheat modules are ‘plug and play’, allowing preheat configurations to be located in any position, location, and 100% interchangeable.
Fluxing Technologies
As the complexity of board assemblies continues to increase, fluxing quality has become more of a focus to ensure soldering quality. Electrovert offers the best fluxing technologies available in the marketplace. The ServoJet fluxing system provides the ultimate in precision deposition and hole penetration (OA version available for aggressive flux applications) while ServoSonic™ and ServoSpray™ fluxing systems are available for ultrasonic and value-based solutions.
UltraFill Solder Nozzle
The patented UltraFill solder nozzle is an ideal solution for lead-free soldering. The UltraFill nozzle is 40% wider than traditional tin-lead nozzle to increase contact time. The nozzle placement reduces the temperature drop between nozzles and improves hole fill. UltraFill allows either air or nitrogen operation through the same design without switching nozzles. Nitrogen or air operation can be selected through the desired recipe, without the need to change nozzles (also available with the rotary chip nozzle).
DwellFlex 4.0 Solder Nozzle with Nitrogen Tunnel
The DwellFlex 4.0 is the first solder nozzle designed specifically with Industry 4.0 automation in mind. The patent pending design enables the length of the wave to be adjusted on-the-fly as variable board types are run through the wave. This ensures solder contact time is optimized for a high-mix of board types without changing conveyor speeds.
The DwellFlex 4.0 provides the highest level of soldering capability for thermally challenging and difficult solder applications. The single wave design at maximum opening delivers the most thermal energy and longest dwell time in the industry.
DwellMax Plus Solder Nozzle with Nitrogen Tunnel
DwellMax Plus is a patented process solution that meets the challenges of lead-free wave soldering. The extra-wide chip nozzle and modified UltraFill nozzle are ideal for soldering thick, high thermal mass circuit boards, increasing throughput capability and process flexibility across a wide range of products. With conventional wave soldering technology, thick multi-layer and/or high thermal mass circuit boards are often accompanied by high cost from low yields, slow production speeds, rework costs, and the collateral damage associated with a rework loop. The innovative design of DwellMax Plus alleviates these problems and provides better PTH fill at significantly faster conveyor speeds. The benefits of the nitrogen tunnel include improved solder wetting and reduction in dross by up to 83%.
Short Nitrogen Tunnel Feature
Electrovert’s nitrogen tunnel utilizes patented technology that inerts at the solder wave area only. This efficient approach maintains a very low oxygen environment of <50 ppm which is ideal for increased wetting effects and a significant reduction of dross.
Full Nitrogen Tunnel Feature
Electrovert’s full nitrogen tunnel with nitrogen inerting technology feature offers complete process capability and flexibility for all nitrogen soldering applications. The full nitrogen tunnel feature is an efficient design that maintains a very low oxygen environment of <50 ppm which is ideal for increased wetting effects and a significant reduction of dross.
ExactaWave Automatic Wave Height
ExactaWave is a patented, high-reliability sensor with closed-loop feedback designed to control the solder wave height relative to the board. Its ability withstand temperatures up to 300°C (573°F) makes it perfectly suited for precision soldering applications.
The ExactaWave system compensates for changes in solder level, dross accumulation and set-up changes made during maintenance. Thus, a set-point entered in a recipe always produces the same result. The ExactaWave’s seamless integration into the soldering machine’s software also allows it to operate in standby mode and is a parameter that can be data logged with trending capability.
ServoJet Fluxing Application System
The ServoJet system ensures thorough flux penetration by utilizing concentric air atomization. It offers a programmable method of applying flux that results in consistent flux deposition and reduced flux usage. The ServoJet utilizes air atomized multiple jet technology that is 100% integrated into the wave soldering system software.
ServoSpray Flux Application System
ServoSpray provides an ideal balance between system performance, functionality and low cost of ownership. ServoSpray has the ability to spray in one or both directions, includes self-clean capability, and features a pressure tank flux supply system. ServoSpray utilizes atomized air delivery technology and is 100% integrated into the wave solder machine software.
ServoSonic Flux Application System
The ServoSonic is a reciprocating ultrasonic atomizing spray fluxing system. It consists of an ultrasonic atomized spray nozzle and air impact nozzle with an automatic self-cleaning function. The titanium nozzle and horn assemblies make the ServoSonic an ideal solution for high solids and aggressive water soluble fluxes.
Preheat Features
The Electra is capable of up to 2.4 meters (8 feet) of bottom side preheat and up to 1.8 meters (6 feet) of topside preheat. Multiple forms of preheat are offered for complete process flexibility; these include IsoThermal™ forced convection, fast response IR, and Infrared radiant. All preheat modules are ‘plug and play’, allowing preheat configurations to be located in any position, location, and 100% interchangeable.
Quick Change Solder Pot
Electrovert’s quick change solder pot allows the use of two or more alloys with easy change-over of interchangeable solder pots. This feature is designed for safety, beginning with a robust cart that includes locking devices and safety bars to secure the pot. The quick-change electrical and nitrogen utilities simplify change-over while the warming station (included) significantly reduces changeover time.
Features for Value in Wave Soldering
Electrovert’s Electra, VectraElite, and VectraES offer a wide range of features and capabilities that increase the value of the wave solder process. The value is achieved through reliability, features that provide process flexibility, maximize process control, and ultimately save time and money.