Universal – Advanced Packaging – Fuzion sc
semiconductor performance
at surface mount speeds
- Silicon/SMT, high-accuracy/high-speed assembly
- High accuracy: (±10µm, < 3µm placement repeatability)
- Dual- or single-beam, multiple-spindle heads
- Full range of die and component types and sizes
- Versatile substrate handling
- Broadest range of feeding platforms
- Low-maintenance, accurate over time
- Vision robustness recognition of pins or logic pads
- Stacking support (POP)
- Low-force capability
FuzionSC Models & Specifications
FuzionSC1-11 – Flexible configuration delivering best-in-class throughput and accuracy for semiconductor applications. Offers the widest component range without reconfiguration.
FuzionSC2-14 – High-volume configuration delivering best-in-class throughput and accuracy for semiconductor applications. Maintains superior flexibility over dedicated solutions to support technology changes.
One solution for all advanced packaging challenges
- Accuracy: <10μm, speed: 16K cph, area: 813 x 610mm
- Any feeding option (wafer, tray, tape, tube, bulk, direct die)
- Place high-accuracy actives and passives on one platform
- Pick and place on any substrate, including thin/flex
- Advanced Process Lab (APL): Leading-edge process andmaterials expertise; process optimization, failure analysis